Permabond ES560 Category: 1-Part Epoxies Producer: Permabond

Permabond ES560 is unfilled and self- levelling, making it particularly suitable for electronics potting and encapsulation applications, as well as underfilling and reworking microchips. It withstands thermal cycling and has excellent shock resistance.

 

Permabond ES560 Data:

Producer:
Doc: Document
Category: 1-Part Epoxies

Delivery time:
Same Day Shipment If In Stock

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